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Our CVD complex oxide deposition systems are designed for the unique challenges researches face throughout the materials development lifecycle. Our CVD systems can be retrofitted with a variety of process options, enhancements, and precursor delivery systems.
Typical Applications
Cross sectional view of CVD reaction chamber
with rotary disc reactors
Temperature controlled vapor delivery
manifold features segmented zones
Pumping manifold features radial
exhaust for uniform pumping
- Complex oxide thin film materials research and pilot production
- Ultra-thin film depositions
Deposition Techniques
- CVD
- ALD gas delivery
- Plasma-enhanced CVD (PECVD)
Common Features & Options
- Cylindrical 316L cold wall reaction chamber
- High speed rotating disc reactors enhance depositions
- Accommodates substrates up to 200mm
- Radially-partitioned gas induction system features showerhead design for uniform gas flow
- Advanced pumping manifold design enhances gas flow
- Reactant delivery system (RDS) with flash evaporation chamber (see below for more information)
- Fully automated computer process control
- Full enclosure cabinet design
Process Options & Enhancements
- Substrate heating and rotation
- Inert gas glovebox
- Robotic buffer and transfer chamber
- Reactant, vapor, liquid, and solid precursor delivery
- Atomic layer deposition (ALD) gas module
- Plasma enhancement module with RF controller
- In-situ and inline process monitoring
- In-situ and inline metrology
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