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Bismuth (Bi) Sputtering Targets

Overview

Our comprehensive offering of sputtering targets, evaporation sources and other deposition materials is listed by material throughout the website. Below you will find budgetary pricing for sputtering targets and deposition materials per your requirements. Actual prices may vary due to market fluctuations. Contact international@lesker.com for current pricing or for a quote on sputtering targets and other deposition products not listed.


Specifications

Material TypeBismuth
SymbolBi
Atomic Weight208.9804
Atomic Number83
Color/AppearanceLustrous Reddish White, Metallic
Thermal Conductivity8 W/m.K
Melting Point (°C)271
Coefficient of Thermal Expansion13.4 x 10-6/K
Theoretical Density (g/cc)9.8
Z Ratio0.79
SputterDC
Max Power Density*
(Watts/Square Inch)
10
Type of BondIndium, Elastomer
Export Control (ECCN) 1C229
CommentsResistivity high. Low Melting Point materials not ideal for sputtering.

* This is a recommendation based on our experience running these materials in KJLC guns. The ratings are based on unbonded targets and are material specific. Bonded targets should be run at lower powers to prevent bonding failures. Bonded targets should be run at 20 Watts/Square Inch or lower, depending on the material.


Z-Factors

Empirical Determination of Z-Factor

Unfortunately, Z Factor and Shear Modulus are not readily available for many materials. In this case, the Z-Factor can also be determined empirically using the following method:

  • Deposit material until Crystal Life is near 50%, or near the end of life, whichever is sooner.
  • Place a new substrate adjacent to the used quartz sensor.
  • Set QCM Density to the calibrated value; Tooling to 100%
  • Zero thickness
  • Deposit approximately 1000 to 5000 A of material on the substrate.
  • Use a profilometer or interferometer to measure the actual substrate film thickness.
  • Adjust the Z Factor of the instrument until the correct thickness reading is shown.

Another alternative is to change crystals frequently and ignore the error. The graph below shows the % Error in Rate/Thickness from using the wrong Z Factor. For a crystal with 90% life, the error is negligible for even large errors in the programmed versus actual Z Factor.


Material Notes

NOTE:

  • Some materials and manufacturing methods may yield product with higher than average porosity. Performance may be affected according to process requirements.
  • Some materials and manufacturing methods may yield product with surface imperfections. In many cases, these imperfections are merely visual defects. Performance may be affected according to process requirements.

Export Controlled

NOTE:

  • This is an Export Controlled Material. Restrictions may apply.

SDS
Click here for the Bismuth SDS.
Request A Quote
Can't find the size or material you need? Please use our Materials Quotation Form to request.
Deposition Materials FAQ
Click here for answers to some of the most common questions we get asked.
Contact Us
To speak with someone directly, please call 1-412-387-9200 or email international@lesker.com.

Ordering Table

Material Size Purity Compatible Guns Part # Price Add To
Cart
Material Size Purity Compatible Guns Part # Price Add To
Cart
Bismuth 1.0" Dia. x 0.125" Thick 99.999% All Standard Guns EJTBIXX501A2 $280.00
Bismuth 1.0" Dia. x 0.250" Thick 99.999% All Standard Guns EJTBIXX501A4 $335.00
Bismuth 2.0" Dia. x 0.125" Thick 99.999% All Standard Guns EJTBIXX502A2 $410.00
Bismuth 2.0" Dia. x 0.250" Thick 99.999% All Standard Guns EJTBIXX502A4 $471.00
Bismuth 3.0" Dia. x 0.125" Thick 99.999% All Standard Guns EJTBIXX503A2 $550.00
Bismuth 3.0" Dia. x 0.250" Thick 99.999% All Standard Guns EJTBIXX503A4 $607.00
Bismuth 4.0" Dia. x 0.125" Thick 99.999% All Standard Guns EJTBIXX504A2 P.O.R.
Bismuth 4.0" Dia. x 0.250" Thick 99.999% All Standard Guns EJTBIXX504A4 P.O.R.
Clearance Item Bismuth 4.00" Dia x 0.250" Thick 99.9% All Standard Guns EJTBIXX304A4 P.O.R.
Note Clearance Item = Limited availability and specially priced.

Bonded Assemblies Ordering Table

Material Target
Size
Purity Bonding Type Backing Plate
Size
Compatible Guns PartNo Price Add To
Cart
Material Target
Size
Purity Bonding Type Backing Plate
Size
Compatible Guns PartNo Price Add To
Cart
Bismuth 1.00" Dia x 0.125" Thick 99.999% Elastomer 1.00" Dia x 0.125" Thick All Standard Guns EJUBIXX501A4 P.O.R.
Bismuth 2.00" Dia x 0.125" Thick 99.999% Elastomer 2.00" Dia x 0.125" Thick All Standard Guns EJUBIXX502A4 P.O.R.

Notes: Bonded assemblies to be used in TORUS Mag Keeper guns require Elastomer bonding

 

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