Welcome to the Kurt J. Lesker Company.  

Sign In | Register

Current Region: International (Change) | Contact Us |   RSS   Twitter   LinkedIn   YouTube


Please select your country or region to be
directed to the appropriate Lesker site.

Elastomer Target Bonding Service

Benefits of Bonding Sputtering Targets

  1. A material can transfer heat through its thickness faster when the material is thinner. For most sputtering R&D guns, the thickness of the target is reduced to half when it is bonded to a backing plate because the gun has a maximum thickness allowance. The copper backing plate comprises the other half of the thickness. The thinner target can cool more effectively than a thicker target because the distance that the heat generated on the surface of the target has to travel to reach the cooled side is reduced.
  2. A ceramic material can cool more efficiently when bonded. The target is in intimate contact with the conductive solder layer which draws the heat from the target surface and into the copper backing plate. The copper backing plate is in contact with the water cooled gun so the heat is transferred through both pieces of copper and is removed through the cooling water.
  3. Some ceramic sputtering targets will crack during sputtering due to thermal shock regardless of whether the target is bonded or the ramping procedure used to condition the target. Bonded targets can usually continue to be used even after a target crack occurs, where typically an un-bonded target cannot.


Elastomer is an alternative bonding method that touts a higher temperature capability over the indium bond. Elastomer bonds are recommended when customers are consistently melting indium bonds. We also recommend elastomer bonding for low melting point target materials, as well as, temperature sensitive compounds and targets that have either low density or are especially fragile. Elastomer bonding is performed at relatively low temperatures between 50°C and 100°C so it is gentler on the target during the actual bonding process. Many customers hesitate to choose the elastomer bond because they know that most polymer based materials will outgas in a vacuum chamber. The elastomer bond is actually UHV compatible and has a NASA "A" rating which means that it undergoes less than a 1% total mass change at 150°C at 1 x 10-7 Torr for 24 hours. In addition, the elastomer does not absorb any moisture and is more than suitable to handle cycles between vacuum and atmosphere. Some materials that require elastomer bonding are the following:

Specifications Table

Maximum Operating Temperature (°C) 250 ° C
Thermal Conductivity (W/mK) 54
Coefficient of Thermal Expansion (K-1) 2.2 x 10-4
Electrical Resistivity (ohm-cm) 0.0476
Bond Coverage >98%
Bond Line Thickness 0.010” – 0.025”

Product Datasheet
Click for a downloadable datasheet on the Elastomer Target Bonding Service.
Deposition Materials FAQ
Click here for answers to some of the most common questions we get asked.
Contact Us
To speak with someone directly, please call 1-412-387-9200 or email international@lesker.com.

Ordering Table

PartNo Price Add To
PartNo Price Add To
1" to 2" Diameter
Metal or Ceramic
EJBOND1-ELAS $190.00
3" to 4" Diameter
Metal or Ceramic
EJBOND3-ELAS $310.00
5" to 6" Diameter
Metal or Ceramic
EJBOND5-ELAS $370.00
7" to 8" Diameter
Metal or Ceramic
EJBOND7-ELAS $430.00


Kurt J Lesker Company Logo

Buy Online or Call
+1 412 387 9200

ISO:9001 The Kurt J. Lesker Company is an ISO:9001 certified company. Copyright ©1996-2017 Kurt J. Lesker Company® All rights reserved.