Kurt J. Lesker Company | Materials Division | Vacuum Science is our Business

R&D Materials - Circular Sputter Targets, Evaporation Materials, Thermal Sources

Production Materials - Sputter Targets, Evaporation Materials, Tungsten Filaments

Precious Metals - Sputter Targets, Evaporation Materials

Services - Target Bonding, Precious Metal Reclaim

Our ISO 9001:2008 certified Materials Division stocks a vast assortment of pure materials, evaporation sources, and crucible liners for use in both thermal and E-beam evaporation as well as sputter deposition processes. We offer pure elements, compounds, alloys, ceramics, intermetallics, and mixtures in a variety of shapes, sizes, and purities for R&D applications. We also offer our materials customers sputter target bonding and precious metals reclamation services, saving you both time and money. And now you can download MSDS and Material Certification Sheets from our website for most materials.


CMM Division	Evaporation Pellets, Pieces, & Wire	Sputtering Targets
The Ceramic Materials Manufacturing division of the Kurt J. Lesker Company manufactures advanced metal oxide ceramic materials that are used for a range of applications including storage of energy and information, energy conversion, optics and electronics. These materials are used for a variety of thin film physical vapor deposition (PVD) processes such as sputtering, laser ablation and evaporation. They can also be packaged as inks, suspensions and slurries used to make in non-vacuum coatings for printed electronics, and as fine chemicals for end users who do their own bulk ceramic fabrication. More Info >	We sell these pellets and pieces by unit weight for evaporation use in deposition processes. These approximate materials prices are published to provide budgetary guidelines. Actual prices can very and may be higher or lower, as determined by availability and market fluctuations. More Info >	Our comprehensive offering of sputtering targets, evaporation sources and other deposition materials is listed by material throughout the website. Below you will find budgetary pricing for sputtering targets and deposition materials per your requirements. Actual prices may vary due to market fluctuations. More Info >

Thermal Filament Sources	Thermal Boat Sources	Thermal Box Sources
Choose a heater shape that best matches the substrate's area requirements and the characteristics or form of material you plan to heat. When heating the same material multiple times, these heaters are sometimes satisfactory for more than a single-time use. More Info >	Choose a heater shape that best matches the substrate's area requirements and the characteristics or form of material you plan to heat. When heating the same material multiple times, these boat heaters are sometimes satisfactory for more than a single-time use. The Part No. listed in the ordering table carries the boat material code. "MO" indicates molybdenum, "TA" indicates tantalum, and "W" indicates tungsten. More Info >	Choose a heater model to match the form and size of the sample you plan to heat. Occasionally, heaters can be used more than once when heating the same material. Select tantalum baffle box and the appropriate baffle cover per application. More Info >

Thermal Rod Sources	Crucibles & Crucible Heaters	Target Bonding
Used to produce thin films of chromium by evaporation in the electronics and optics industries. Advantages over chromium chips: Good thermal efficiency Better regulation of film thickness Elimination of spalling 99.9% pure Cr More Info >	Intermetallic crucibles have proven to be a reliable choice for thermal evaporation of aluminum. Due to the wetting characteristics of liquid aluminum, taller crucibles help inhibit the spill over of the material by maintaining a cool lip around the top. Tall intermetallic crucibles offer a longer lifetime of both the crucible itself as well as the crucible heater. Thin films of titanium can also be evaporated from intermetallic crucibles. Film thickness may be limited to 500Å. The crucible may need to be replaced for each subsequent run. More Info >	Indium is the preferred method for bonding sputtering targets because it has the best thermal conductivity of all available bonds and is the most efficient at drawing heat away from the target. Indium is also more malleable than other bonding solders and therefore it is more forgiving. The softer solder allows some "give" when the target expands at a different rate than the backing plate. This reduces cracking that is caused by mismatch in the thermal expansion coefficients of the target and backing plate. The main limitation of the indium bond is the melting temperature of the indium solder. Indium has a melting point of 156.6°C so temperatures in excess of 150°C will cause the bond to melt and fail. Most materials can be indium bonded but there are a few exceptions. More Info >