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Atomic Layer Deposition Systems

Atomic layer deposition (ALD) is a thin film deposition technique that is based on the sequential use of a gas phase chemical process that enables surface-controlled film growth on the atomic scale with excellent uniformity.

ALD150LE – Thermal Atomic Layer Deposition System, Up to 6" Substrates

  • KJLC's most affordable atomic layer deposition system platform, designed specifically with the entry to mid-level user in mind.
  • Typically used in the university and government lab R&D environment.
  • Purely thermal atomic layer deposition technique.
  • Up to 9 HVP reactant inputs, or up to 7 HVP with 1 LVP reactant inputs; up to 4 pulsed gas inputs.
  • Hydrocarbon or Fomblin®-prepped wet rough pumping, oil filtration and condensate trap options available.
  • Standard configuration compatible with up to 6" OD substrates, up to 500°C heating, glove box option available.
  • All-In-One arm-mounted computer system control software with recipe control.
More Info



ALD150LX – Plasma Enhanced Atomic Layer Deposition System, Up to 6" Substrates

  • KJLC's most capable atomic layer deposition system platform, designed specifically with the mid to high-level user in mind.
  • Typically used in the university and government lab R&D environment.
  • Facilitates thermal and plasma enhanced atomic layer deposition techniques.
  • Up to 14 HVP reactant inputs, or up to 2 HVP with 2 LVP reactant inputs, up to 4 pulsed gas inputs.
  • Remote plasma source option with up to 3 reactant gas inputs.
  • Hydrocarbon, Fomblin-prepped, or dry rough pumping; oil filtration and condensate trap options available.
  • RGA package, in-situ ellipsometer, and single or multi-wafer load lock options available.
  • Standard configuration compatible with up to 6" substrates, up to 500°C heating.
  • All-In-One arm-mounted computer system control software with recipe control.
More Info

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