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Thin Film Deposition System Platform

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To request a quotation on one of our PVD system platforms please see start with our Physical Vapor Deposition Systems Questionnaire.
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To speak with someone directly please call 1-412-387-9200 or email international@lesker.com.
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2018 NANO 36™ – Affordable, Compact Sputtering or Thermal Evaporation Thin Film Deposition System

Techniques Offered:

  • Low Temperature Evaporation sources
  • Thermal Evaporation
  • Magnetron Sputtering
  • Multiple Techniques

Options

HV Pumping Options

  • Dry Pump - Edwards nXDS6i - 3.6 cfm (6.2 m3/hr) Scroll roughing pump.

HV Valves

  • 3-position gate valve for Pfeiffer 260 L/sec turbo


Process Equipment Options

Low Temperature Evaporation Sources (Up to Four)

  • 1cc and 10cc Sources
  • Unique Plugin Design
  • Easy to Refill and Maintain
  • Quartz crystal controller is available with thermal options
  • KJLC 10cc and 1cc (Low Temperature Evaporation) source, suitable for Organic and low temperature materials (0-550°C)

Thermal Evaporation Source (Up to Four)

  • KJLC Thermal evaporation (TE) assembly, Up to four 2" thermal evaporation sources (in sequential and co-deposition configurations)
  • Standard thermal power supply (5v @ 150A)
  • Quartz crystal controller is available with thermal options

Low Temperature Evaporation Sources (Up to Two) and Thermal Evaporation Source (Up to Two)

  • Provides capability to have up to two LTE and up to two Thermal Evaporation sources on one base plate
  • Source sizes available are the same on the combination base plate as on the LTE only and Thermal Evaporation only base plates
  • Quartz crystal controller is available with the combination base plate option

Torus® Magnetron Sputtering Source (Up to Three)

  • Up to Three KJLC Torus® 2" or 3" magnetron sputtering sources. Flex head assembly and high strength magnet assembly options available.

For more information on our new Mag Keeper sources please see the following link.

(Up to Three) Power Supplies

  • 500W, and 1kW, and 1.5kW KJLC® DC power supplies
  • 300W KJLC RF power supply
  • Quartz crystal monitor is available with sputtering options


Substrate Options

Substrates

The 2018 Nano 36 is designed to allow the use of square substrates 100mm x 100mm or smaller and round substrates up to 150mm diameter or smaller. The substrate platen accommodates multiple size substrates using a KJLC multi-site fixture and substrate clips. Custom substrate/mask holders are available upon request.

Standard substrate fixture options include:

  • Static platen
  • Static with heating (up to 800°C)
  • Static with water cooling
  • Rotation (up to 20 rpm)
  • Rotation with heating (up to 350°C)
  • Rotation with water cooling



Upstream Pressure Control

  • Up to two Fujikin FCST1000F Mass Flow controllers and a 100mTorr Capacitance Manometer

Reactive Depositions

  • One Fujikin FCST1000F Mass Flow controller and a 100mTorr Capacitance Manometer
  • One Fujikin FCST1000F Mass Flow controller for a reactive gas.

Glovebox Adaptors

The 2018 Nano 36 is now easily integrated with a glove box and the process chamber features spring-loaded, pendulum style, full-access, aluminum doors. This new chamber design makes opening and closing the chamber door inside the glovebox a snap while providing quick and easy access to your substrate fixture and deposition sources. We also designed in a chamber back door option for glovebox integrated systems to allow chamber access while maintaining glovebox integrity.

Kurt J Lesker is able to offer a wide array of standard and custom glovebox suites, from a standard 2 port and 4 port arrangement, to custom lengths and Depths.


Glovebox Specifications

  • Glovebox: Stainless steel (SUS 304), with welded side panels.
  • Antechamber: Stainless steel (SUS 304), 370, length 600mm, thickness 3mm.
  • Mini Antechamber: Stainless steel (SUS304), Q 100mm, length 300mm, thickness 3mm; welded onto side panel, leak-free; removable sliding tray.
  • Support Frame: Height adjustable from 915mm to 975 mm
  • Feedthrough Connectors: Four standard KF40 connectors for customer use.
  • Shelves: Two storage shelves can be used to store samples and small labware.
  • Gas Filter: Two 0.3pm filters installed at the circulation inlet and outlet.
  • Foot Switch: Adjusts the pressure inside the glovebox.
  • Purifier: Contains copper-based catalyst for removing oxygen and zeolites for moisture removal.
  • The oxygen and water capacities are 30 L and 2.0 kg, respectively and the purifier can be regenerated.
  • Solenoid purge valve: For automatic purge, this also serves as pressure relief valve.
  • Circulation Blower: Fuji Blower, low noise, flow rate 45m3/h
  • Oxygen Analyzer: PLC integrated, enabling auto-circulation of the purifier
  • Moisture Analyzer: PLC integrated, enabling auto-circulation of the purifier
  • Impurity Level: O2 < 1 PPM; H20 < 1 PPM
  • Overall leak rate: < 2 PPM O2/ hr or < 0.001 vol%/hr; Lowest leak rate in the industry, extends the regeneration interval and purifier's life

Glovebox Options

Along with the gloveboxes and system adaptor boxes the following accessories can be supplied:

  • Spin Coaters
  • Hot Plates
  • UV Ozone Curing
  • Regenerable Solvent Purification System
  • Other accessories upon request

Deposition:

The 2018 Nano 36 offers single and multi-technique deposition options (Thermal + LTE only) including thermal evaporation and magnetron sputtering (Torus).

Torus® sources are operated at typical sputtering pressures (< 20 mTorr) and utilize Si wafers for deposition. SiO2 Target run with RF Power, film thickness >=500Å. Al Target run with DC Power, film thickness >=1500Å. Ni Target run with High Strength Torus® & DC Power, film thickness >=1500Å.

  • All Films are measured on a properly calibrated Profilometer, Reflectometer or Ellipsometer (if applicable).
  • Measurement points are taken starting at the center of the substrate and then radially outward every 0.5 inches (12.7mm), nominally (reference figure to the right).
  • Uniformity calculation formula is: ((Max - Min) / (2 x Avg)) x 100% with a 0.2 inch (5mm) edge exclusion.

Only KJLC offers Mag-Keeper sputter sources with zero o-rings in the cathode body and a magnetically coupled target to allow for easy target changes. (A game changer when changing a target through a glove box!) Our "patent pending" cooling well design enables operation at power densities ≥ 200 watts/.in2. This cathode is designed to sputter up to a 0.375" thick target on the 3" cathode and up to a 0.250" thick target on the 2" cathode. The high strength design is able to sputter up to a 0.125" thick Fe target with 3" cathodes, or 0.0625" thick Fe target with 2" Mag-Keepers. Without a hold down clamp or dark space shield this cathode is capable of running as low as ≤ 1mTorr. The unique dome shutter design eliminates the need for additional cross contamination shielding required with standard flip or swing shutters.

To learn more about sputtering rates and uniformity, click here.



Architecture Overview

KJLC® eKLipse™ Control Software

Kurt J. Lesker Company® eKLipse™ Controls Software is utilized on all KJLC platforms. The eKLipse™ controls platform utilizes a .NET application running on a Windows PC for its User Interface and Recipe Editor. Equipment automation is accomplished via a standalone Real Time Controller.

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Recipes

  • Graphical Recipe Builder – Easily create recipes by clicking on the desired component and set that item's attributes







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  • Scripted Recipe Builder – A more traditional "scripted" recipe editor exposes more details for setting or checking the value of any system component during a process.



Reliable

This control platform was developed by <strong>KJLC's global engineering team</strong> and is supported by <strong>KJLC global service center</strong>.
  • Real Time Controller – The system operates independently of the Windows software package and will continue the recipe should the software / computer malfunction.
  • Independent Thermal Evaporation Thin Film Control – There is no third party software requiring a "handshake" or "handoff" between the Systems Manufacturers software and the thin film controller's software.



Unlimited Recipes, (import/export capable)

  • Unlimited recipes with user security level features
  • Recipe import/export capability (for transferring recipes between similarly equipped tools)
  • Any recipe step can be configured to allow the user to alter a value, enabling process condition changes, without affecting the master recipe. As an example, at the time of execution, the recipe can prompt the user for the desired deposition thickness, or power setting.
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  • Consistent User experience across all deposition techniques and KJLC platforms (Sputter, Thermal, EBeam, ALD)
  • Multi chamber and multi PC control for cluster tools



Custom Chart Recorder and Datalogging

  • Custom Chart with up to 10 simultaneous plots
  • Chart Recorder can be used to display any setpoint or feedback parameter
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  • Automatic datalogging of each recipe step for all recipes
  • Chart data and configuration can be saved

  • Graphical selection of signals to be recorded









Custom Maintenance Counters

  • Custom Maintenance Counters are available for each component
  • Periodic Maintenance interlocks and recipe checks can be configured for any maintenance counter
  • Sputter Target kiloWatt*Hour and custom material usage tracking








User Security

  • Supports multiple user accounts and password levels with custom security access for recipes and screens
  • Software screen access can be customized per user
  • Recipe editing and manual operation features can be assigned on a per user basis;
  • Users with full access have the ability to edit recipes and control interlocks. Restricted access users will be limited to running certain recipes and have no control over interlocks.
  • Every control object can be assigned to a standard user security level.
  • Individual screen access can be separately assigned to any user.
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Multi User Facility Features

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  • System event log captures all user login/logout events, all recipes executed, and system status messages
  • Interlocking of vacuum and deposition equipment provides continuous system status monitoring while restricting unapproved system usage (no need to 'power off' system screen or PC)



Remote Support Utility and Apps

  • Customized Version of TeamViewer allows remote support (free Android and IOS apps)
  • Remote connection supports system monitoring/control and file transfer
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Media Gallery

Photo Gallery

Downloads & Documents

View information on major components, floor planning and site preparation regarding your product.

Datasheets & Component Lists

 

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