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Uncovered Potential of Co2MnGa in Spintronics

October 26, 2020 | By KJLC Innovate

The Kurt J. Lesker Company continues to support the researchers who are advancing the science and technology of spintronics around the world. Co2MnGa, a Heusler material, has been attractive to scientists as a novel magnetic conducting material on which spintronic structures like magnetic tunnel junctions can be built. Recent work, published in Applied Physics Letter titled "Perpendicular magnetic anisotropy in Co2MnGa and its anomalous Hall Effect" by Dr. Ludbrook, Dr. Ruck and Dr. Granville from Victoria University of Wellington, New Zealand, has identified characteristics of thin film Co2MnGa that are necessary for realizing magnetic tunnel junctions.

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INNOVATE Systems Vacuum Science Deposition Techniques



Comparison of Hafnium Dioxide & Zirconium Dioxide Grown by Plasma-Enhanced Atomic Layer Deposition for the Application of Electronic Materials

October 01, 2020 | By KJLC Innovate

Dr. Zhigang Xiao, Professor of Electrical Engineering at Alabama A&M University, in collaboration with the ALD group in the Kurt J. Lesker Company recently developed the plasma-enhanced atomic layer deposition process and grow high dielectric constant (K) oxide for the application of electronic materials. They grew nanoscale hafnium dioxide (HfO2) and zirconium dioxide (ZrO2) thin films using remote plasma-enhanced atomic layer deposition (PE-ALD) and fabricated complementary metal-oxide semiconductor (CMOS) integrated circuits using the HfO2 and ZrO2 thin films as the gate oxide. Miniaturization in modern semiconductor industry requires thin film deposition to have atomic level control and the deposited film to be conformal and pinhole-free. As MOSFETs are scaled down to nanometer sizes, the tunneling currents through the gate dielectrics (the gate leakage current) has become a major concern in today’s fabrication of integrated circuits (ICs). High-K dielectric metal oxide could be a solution to the problem of the gate leakage current. The plasma-enhanced atomic layer deposition of HfO2 and ZrO2 thin films meets the requirement and can produce conformal and ultra-thin films with precise thickness control at the atomic layer level. The experimental results measured from the HfO2 and ZrO2 thin films were compared.

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INNOVATE Systems Vacuum Science Deposition Techniques



Tips For Thermally Evaporating Aluminum

June 16, 2020 | By KJLC Blog

By far one of the most common questions that we receive from various users is how to thermally evaporate Aluminum. Aluminum is very commonly evaporated for various applications and can be somewhat problematic. Through some internal experience and through with working with various customers, we recommend two ways to approach thermal evaporation of aluminum.

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Vacuum Science Deposition Materials Deposition Techniques



Equivalent Oxide Thickness (EOT) Scaling with Hafnium Zirconium Oxide High-K Dielectric from a Surprising Boost in Permittivity

June 01, 2020 | By KJLC Innovate

Dr. Kai Ni from the research group of Professor Suman Datta, Stinson Professor of Nanotechnology at the University of Notre Dame, in collaboration with Purdue University and Kurt J. Lesker Company recently developed conformal atomic layer deposition (ALD) based hafnium zirconium oxide thin film processes displaying excellent electrical properties for potential gate oxide complement or replacement in scaled logic and memory technology nodes. The findings were recently published and showcased in the IEEE International Electron Devices Meeting (IEDM) 2019 in San Francisco, CA [ref. 1]. In particular, hafnium zirconium oxide (HfxZr1-xO2, or HZO) has emerged as a ferroelectric (large charge density per unit area) material system that also displays a tunable permittivity or dielectric constant (charge response) depending on the concentration of Zr added to the base HfO2 oxide. The reported films indicate that by sweeping the concentration of Zr in HfO2 during the ALD growth, a substantial boost in the dielectric constant can be observed around 70% Zr concentration due to the presence of a crystallographic phase transition of the underlying HZO material structure, which results in enhanced electrical performance even in ultrathin films 25Å thick [ref. 2]. These findings elucidate the necessity and importance of extremely stringent deposition process control along with corresponding electrical and structural characterization for the understanding of new materials systems for their further implementation in commercial applications such as high-performance digital and analog CMOS technology at advanced nodes.

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INNOVATE Systems Vacuum Science Deposition Techniques



Durability of Automotive Exhaust Systems Enhanced by Heat Treatment in High Vacuum

May 01, 2020 | By KJLC Blog

In a recently issued patent (US 10,619,950 April 14, 2020) researchers at the Toyota Motor Company have demonstrated that the corrosion resistance of stainless steel exhaust systems for cars and trucks can be substantially improved by heat treatment in high vacuum. Stainless steel is a complex metal alloy of iron, nickel, chrome and other elements. It is known to be a very durable metal but even this robust material can be corroded by exposure to chloride ions, sulfuric and hydrochloric acids, soot and other artifacts of the exhaust from an internal combustion engine. Reaction with these aggressive gases causes pits in steel which eventually lead to premature failure. The use of low-grade fuels speeds the degradation of exhaust systems.

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INNOVATE Systems Vacuum Science Deposition Techniques



Why Did My Bond Melt?

April 21, 2020 | By KJLC Blog

As a Product Manager in the Materials Division, I field a lot of questions from customers from many different industries with varying degrees of sputtering experience. One of the more common emails that I receive goes something along the lines of, "There's something wrong with my bonding because the indium has melted out of the sides of my target." Often times the user has waited for their target, spent money on it, only to use it one time and had to stop due to the melted bond. A frustrating situation for sure.

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Vacuum Science Deposition Materials Deposition Techniques



3D Deposition of Conformal Lead-Based Ferroelectric & Piezoelectric Thin Films by Atomic Layer Deposition

March 06, 2020 | By KJLC Innovate

Dr. Nicholas A. Strnad (General Technical Services, LLC) in collaboration with the U.S. Army Combat Capabilities Command Army Research Laboratory and the University of Maryland, College Park have recently developed conformal processes for a variety of lead-based electronic materials with outstanding properties using atomic layer deposition (ALD)...

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INNOVATE Systems Vacuum Science Deposition Techniques



The Effect of Sputter Cathode Design on Deposition Parameters: Design Enhancements Expand Capabilities for the Magnetron Sputtering of Thin Films

July 22, 2019 | By KJLC Innovate

Sputtering is a relatively mature approach for the deposition of a variety of thin film materials. Initial publications on the process date to the early 1800s. In its simplest form sputtering provides a route to manufacture high quality reflective coatings for mirrors and potato chip bags; and at the extreme end, for creating the most advanced semiconductor computing devices in the world.

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INNOVATE Systems Vacuum Science Deposition Techniques



Sources and Solutions for Contamination Issues in Space Simulation (TVAC) Systems

May 09, 2018 | By KJLC Innovate

The current push to commercialize space travel has resulted in renewed demand to launch objects and even people into earth orbit or event deep space. Companies including SpaceX, Blue Origin and Rocket Lab have demonstrated the ability to make certain portions of a launch vehicle reusable and that may dramatically alter the cost to get to space. True rocket ship factories are emerging which, in one case, can put out a couple of full blown launch vehicles every month!

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INNOVATE Systems Vacuum Science Deposition Techniques



KJLC® Awarded a Patent for its Atomic Layer Deposition System and Process

November 28, 2017 | By KJLC Innovate

The Kurt J. Lesker Company® (KJLC®), a global manufacturer of vacuum systems, thin film deposition tools and vacuum components, today announced that the United States Patent and Trademark Office has issued US patent number 9,695,510, 'Atomic Layer Deposition Apparatus and Process', covering the design of an atomic layer deposition system and the process to use that system to deposit highly precise and conformal thin films. This proprietary technology substantially reduces the interaction of various precursor gas molecules with the internal surfaces of the reaction chamber and enables actual focusing of gas streams to more effectively coat the surface of arbitrarily large substrates.

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INNOVATE Systems Vacuum Science Deposition Techniques



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