Lesker U Live! is series of free webinars spanning many topics taught by leading vacuum experts.
Lesker U provides the following:
- High-value vacuum expert training
- A solid base of understanding surrounding vacuum technology
- Deep dives on specific vacuum technology topics
This class is designed to introduce the student to fundamental concepts and operating principles for the deposition of thin films by thermal and e-beam evaporation as well as sputtering by direct current magnetron sputtering (dcMS), pulsed dcMS. radio frequency magnetron sputtering (RfMS) and high impulse power magnetron sputtering (HiPIMs) techniques. It includes a recap of basic vacuum technology, followed by fundamental design and operational aspects of each thin film deposition technique as it impacts thin film properties. Issues such as deposition rate, film uniformity, morphology and density are discussed.
Several models for thin film growth are presented with reference to how specific materials properties and deposition conditions may affect thin film characteristics. The student should achieve a general understanding of thin film deposition by physical vapor techniques and be familiarized with available resources for further training. This course also includes several short quizzes to better enable the learning process. Students who attend the class can receive a personalized certificate of attendance signed by the course instructor.
Duration: 2 Hour(s)
Expert(s): J.R. Gaines
J.R. Gaines is the Technical Director of Education for the Kurt J. Lesker Company, (Jefferson Hills, PA). The Lesker Company is a global scientific equipment manufacturer supplying materials and tools for vacuum-enabled innovation. Gaines has more than 40 years of experience in the research, development and commercialization of advanced materials technologies including superconductivity, semiconductors, cryogenics, space simulation, energy generation, energy conversion and storage. His experience includes vacuum systems, thin film deposition, inorganic chemistry, nanotechnology and advanced ceramic processing.