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Ruthenium (Ru) Sputtering Targets

Ruthenium (Ru) Sputtering Targets Overview

Our comprehensive offering of sputtering targets, evaporation sources and other deposition materials is listed by material throughout the website. Below you will find budgetary pricing for sputtering targets and deposition materials per your requirements. Actual prices may vary due to market fluctuations. To speak to someone directly about current pricing or for a quote on sputtering targets and other deposition products not listed, please click here .

Ruthenium (Ru) General Information

Ruthenium is a rare metal which belongs to the platinum group of elements on the Periodic Table. It has a melting point of 2,310°C, a density of 12.3 g/cc, and a vapor pressure of 10-4 Torr at 2,260°C. It is silvery white in appearance and typically alloyed with other metals to improve durability and corrosion resistance. Its compounds are often found in electrical contacts and computer microchips. It is evaporated under vacuum to produce semiconductors, magnetic storage media, and fuel cells.

Ruthenium (Ru) Specifications

Material TypeRuthenium
SymbolRu
Atomic Weight101.07
Atomic Number44
Color/AppearanceSilvery White Metallic
Thermal Conductivity120 W/m.K
Melting Point (°C)2,310
Coefficient of Thermal Expansion6.4 x 10-6/K
Theoretical Density (g/cc)12.3
Z Ratio0.182
SputterDC
Max Power Density
(Watts/Square Inch)
100*
Type of BondIndium, Elastomer

* This is a recommendation based on our experience running these materials in KJLC guns. The ratings are based on unbonded targets and are material specific. Bonded targets should be run at lower powers to prevent bonding failures. Bonded targets should be run at 20 Watts/Square Inch or lower, depending on the material.


Z-Factors

Empirical Determination of Z-Factor

Unfortunately, Z Factor and Shear Modulus are not readily available for many materials. In this case, the Z-Factor can also be determined empirically using the following method:

  • Deposit material until Crystal Life is near 50%, or near the end of life, whichever is sooner.
  • Place a new substrate adjacent to the used quartz sensor.
  • Set QCM Density to the calibrated value; Tooling to 100%
  • Zero thickness
  • Deposit approximately 1000 to 5000 A of material on the substrate.
  • Use a profilometer or interferometer to measure the actual substrate film thickness.
  • Adjust the Z Factor of the instrument until the correct thickness reading is shown.

Another alternative is to change crystals frequently and ignore the error. The graph below shows the % Error in Rate/Thickness from using the wrong Z Factor. For a crystal with 90% life, the error is negligible for even large errors in the programmed versus actual Z Factor.

Notes:
  • Bonding is recommended for these materials. Many materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity. Request more information, please click here.
  • This material may require special ramp up and ramp down procedures. This process may not be necessary with other materials. Targets that have a low thermal conductivity are susceptible to thermal shock. Please click here for Ramp Procedure for Ceramic Target Break-in.

SDS
Click here for the Ruthenium SDS.
Precious Metals
Reclaim Service
We offer a precious metal reclaim program, designed to reduce replacement costs.
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Deposition Materials FAQ
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Process Equipment Expertise
Process Equipment Expertise

By staying on the leading edge of engineering and technology, we offer our customers the advantage of unparalleled knowledge and expertise in the manufacturing of TORUS® Magnetron Sputtering Cathodes and Thin Film Deposition Vacuum Systems.

Ordering Table

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Material Description Size Purity Compatible Guns Notes Part Number Price In Stock Add To Cart
Material Description Size Purity Compatible Guns Notes Part Number Price In Stock Add To Cart
Ruthenium RUTHENIUM TARGET, Ru, 99.95% PURE, 1.00" DIAMETER X 0.125" THICK, +/-0.010" ALL 1.00" Dia. x 0.125" Thick 99.95% Most Standard Guns 1 EJTRUXX351A2 P.O.R. In Stock
Ruthenium RUTHENIUM TARGET, Ru, 99.95% PURE, 1.00" DIAMETER X 0.250" THICK,+/-0.010" ALL 1.00" Dia. x 0.250" Thick 99.95% Most Standard Guns 1 EJTRUXX351A4 P.O.R. Call for Availability
Ruthenium RUTHENIUM TARGET, Ru, 99.95% PURE, 2.00" DIAMETER X 0.125" THICK, +0/-0.010" ALL 2.00" Dia. x 0.125" Thick 99.95% Most Standard Guns 1 EJTRUXX352A2 P.O.R. In Stock
Ruthenium RUTHENIUM TARGET, Ru, 99.95% PURE, 2.00" DIAMETER X 0.250" THICK, +0/-0.010" ALL 2.00" Dia. x 0.250" Thick 99.95% Most Standard Guns 1 EJTRUXX352A4 P.O.R. Call for Availability
Ruthenium RUTHENIUM TARGET, Ru, 99.95% PURE, 3.00" DIAMETER X 0.125" THICK, +0/-0.010" ALL 3.00" Dia. x 0.125" Thick 99.95% Most Standard Guns 1 EJTRUXX353A2 P.O.R. In Stock
Ruthenium RUTHENIUM TARGET, Ru, 99.95% PURE, 3.00" DIAMETER X 0.250" THICK, +0/-0.010" ALL 3.00" Dia. x 0.250" Thick 99.95% Most Standard Guns 1 EJTRUXX353A4 P.O.R. Call for Availability
Ruthenium RUTHENIUM TARGET, Ru, 99.95% PURE, 3.00" DIAMETER X 6MM THICK, +0/-0.010" ALL 3.00” Dia. x 6mm Thick 99.95% EJTRUXXSPL12 P.O.R. In Stock
Ruthenium RUTHENIUM TARGET, Ru, 99.95% PURE, 4.00" DIAMETER X 0.125" THICK, +0/-0.010" ALL 4.00" Dia. x 0.125" Thick 99.95% Most Standard Guns 1 EJTRUXX354A2 P.O.R. Call for Availability
Ruthenium RUTHENIUM TARGET, Ru, 99.95% PURE, 4.00" DIAMETER X 0.250" THICK, +0/-0.010" ALL 4.00" Dia. x 0.250" Thick 99.95% Most Standard Guns 1 EJTRUXX354A4 P.O.R. Call for Availability
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 Notes: 
1.
Dimensions vary by sputtering gun. Review sputtering gun manual to determine appropriate target size.

Bonded Assemblies Ordering Table

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Material Description Target Size Purity Bonding Type Backing Plate Size Compatible Guns Notes Part Number Price In Stock Add To Cart
Material Description Target Size Purity Bonding Type Backing Plate Size Compatible Guns Notes Part Number Price In Stock Add To Cart
Ruthenium RUTHENIUM TARGET, Ru, 99.95% PURE, 2.00" DIAMETER X 0.125" THICK, +0/-0.010" ALL, INDIUM BONDED TO COPPER BACKING PLATE, OFHC 101, Cu, 2.00" DIAMETER X 0.125" THICK, +/-0.010" ALL 2.00" Dia x 0.125" Thick 99.95% Indium 2.00" Dia x 0.125" Thick Most Standard Guns 1 EJURUXX352A4 P.O.R. Call for Availability
Ruthenium RUTHENIUM TARGET, Ru, 99.95% PURE, 2.00" DIAMETER X 0.125" THICK, +0/-0.010" ALL, ELASTOMER BONDED TO COPPER BACKING PLATE, OFHC 101, Cu, 2.00" DIAMETER X 0.125" THICK, +/-0.010" ALL, W/ KEEPER AND SCREW, FOR 2" TORUS MAG KEEPER 2.00" Dia x 0.125" Thick 99.95% Elastomer 2.00" Dia x 0.125" Thick TORUS Mag Keeper 2 2 EJURUXX352TK4 P.O.R. Call for Availability
Ruthenium RUTHENIUM TARGET, Ru, 99.95% PURE, 3.00" DIAMETER X 0.125" THICK, +0/-0.010" ALL, ELASTOMER BONDED TO COPPER BACKING PLATE, OFHC 101, Cu, 3.00" DIAMETER X 0.125" THICK, +/-0.010" ALL, W/ KEEPER AND SCREW, FOR 3" TORUS MAG KEEPER 3.00" Dia x 0.125" Thick 99.95% Elastomer 3.00" Dia x 0.125" Thick TORUS Mag Keeper 3 2 EJURUXX353TK4 P.O.R. Call for Availability
Ruthenium RUTHENIUM TARGET, Ru, 99.95% PURE, 4.00" DIAMETER X 0.125" THICK, +0/-0.010" ALL, ELASTOMER BONDED TO COPPER BACKING PLATE, OFHC 101, Cu, 4.00" DIAMETER X 0.125" THICK, +/-0.010" ALL 4.00" Dia x 0.125" Thick 99.95% Elastomer 4.00" Dia x 0.125" Thick Most Standard Guns 1 EJURUXX354A4 P.O.R. Call for Availability
Ruthenium RUTHENIUM TARGET, Ru, 99.95% PURE, 4.00" DIAMETER X 0.125" THICK, +0/-0.010" ALL, ELASTOMER BONDED TO COPPER BACKING PLATE, OFHC 101, Cu, 4.00" DIAMETER X 0.125" THICK, +/-0.010" ALL, W/ KEEPER AND SCREW, FOR KJLC TORUS MAG KEEPER 4, PER DRAWING 4.00" Dia x 0.125" Thick 99.95% Elastomer 4.00" Dia x 0.125" Thick TORUS Mag Keeper 4 2 EJURUXX354TK4 P.O.R. Call for Availability
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 Notes: 
1.
Dimensions vary by sputtering gun. Review sputtering gun manual to determine appropriate target size.
2.
Bonded assemblies to be used in TORUS Mag Keeper guns require Elastomer bonding.
Contact Us - Ruthenium Ru Sputtering Targets