TORUS^® Mag Keeper™ UHV Compatible Circular Magnetron Sputtering Sources

Overview

The Mag Keeper™ design is the latest addition to our TORUS^® family of sputtering magnetron solutions. It is offered for target sizes of 2", 3", and 4". The magnetron design utilizes both monolithic and bonded target configurations up to 0.375" thick.

All targets (except for magnetic materials) utilize a bolt-on magnetic "keeper" assembly to fasten the target to the magnetron, which eliminates the need for a target clamp assembly. All bonded targets require an "elastomer" bond.

The magnetron does not utilize an independent "anode shield assembly" that needs to be removed. Instead, there is only an anode wall that sits below the target surface eliminating material build-up and flaking onto the target surface.

Our patented cooling well is the heart of the design, which enables operation at power densities ≥200 watts/.in².

The assembly has NO o-rings and utilizes a single metal seal making it not only UHV compatible, but also capable of handling higher heat loads than our standard TORUS^® design. Its smaller overall footprint also enables us to fit more sources into our standard chamber models.

The assembly is offered with both Standard and High Strength magnet options, which all fit the same cathode design. This allows for easy magnetic optimization of the sources in the field and also provides the ability to integrate an unbalanced field if required.

Features

• Compact Design
• HV and UHV Compatible
• Quick Target Change (No clamp or shield)
• Can sputter targets up to 0.375" thick
• High Mag design can sputter up to 0.125" thick Fe
• Low Operating Pressure - Can run ≤ 1mTorr
• No O-ring seals
• High Power/ High Rate capability

Dimensional Drawings

 

Charts

 

Specifications

Targets

Kurt J. Lesker Company provides a full line of high purity materials.

• Metals: Typically drilled and tapped with keeper attached directly to the target.
  • Tungsten and Tantalum targets require elastomer bonding to backing plates as they cannot be reliably drilled and tapped due to their hard, yet brittle nature.
• Magnetic materials: Directly install with no keeper.
• Ceramics, alloys (depending on the alloy), fragile materials, etc: Require bonding to backing plates with keepers.
  • This is material specific and KJLC an advise if it's unclear
  • Review the power requirements on our web pages pertaining to max power allowed for various materials. Anything bonded will be 20 watts per square inch or less depending on the material.
  • Bonded assemblies will need to be elastomer bonded as it is rated to 250°C whereas indium is only rated to 150°C.

Please contact our materials department at international@lesker.com for a quotation on the targets you need for you application.