Silver-filled epoxy glue has high electrical and thermal conductivities.
Often used to bond conducting sputter targets to a backing plate or connect heat-sensitive components to heat sinks, bonding waveguide plumbing, connecting ground wires to vacuum mounted components, and as a metal solder replacement.
NOTE: Shipped in two separate containers—epoxy glue and hardener. Mix together equal quantities of Part A and Part B on a clean surface (a tongue depressor or wooden toothpick work well for this). When the mixture has a uniform consistency, apply as required. One gram of epoxy will cover 1 sq. in. at 0.030"e; thickness.
Although warming any epoxy (between 50° C and 80° C) during curing shortens the curing time and increases the final bond strength, it leads to initially decreasing viscosity and may cause drips—leading to unintended seals and additional outgassing.
25 x 10-4 W/mK
@25°C: 0.001 ohm-cm @100°C: N/A
@25°C: 1,200 - 2,500 psi
@Room Temp.: 4-5 mo
@Room Temp.: 1-2 hours
Cure Cycle (After Mixing)
@25°C: 18hr @60°C: 2hr
-60°C to 175°C
It is strongly recommend using all fluids and greases at the time of receipt, however when storage is necessary, rotate older stock into use first and observe the recommended parameters listed below.