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Thin Film Deposition System Platform

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To request a quotation on one of our PVD system platforms please see start with our Physical Vapor Deposition Systems Questionnaire.
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Practical Sputter Process Tips
To learn more about sputtering rates, uniformity, and process tips click here.
Evaporation Process Notes
To learn more about the materials we currently provide Thermal and E-Beam Evaporation Process Notes for click here.
How KJLC Is Pushing Perovskite Research
How we've enabled world class vapour deposited Perovskite solar cell research utilizing our line of Organic Material Deposition Systems.
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Mini SPECTROS – Thin Film Deposition & Metallization System up to 100mm x 100mm Substrate

Techniques Offered:

  • Low Temperature Evaporation sources
  • Thermal Evaporation
  • Magnetron Sputtering
  • Electron Beam Evaporation
  • Multiple Techniques

Options

HV Pumping Options

  • Cryo Pump – This package replaces the 790 L/sec turbo pump in the base system with a CTI-8F 1500 L/sec cryo pump. Base pressure for a properly conditioned chamber is 5.3 x 10-8 torr (6.67 × 10-8 mbar).
  • Dry Pump – Edwards nXDS10i – 7.5 cfm (12.7 m3/hr) Scroll roughing pump.
  • Dry pump – Edwards XDS35i – 25 cfm (43 m3/hr) Scroll roughing pump.

HV Valves

  • 3-position VAT gate valve for CTI-8F 1500L/s Cryo Pump
  • 3-position VAT gate valve for Pfeiffer 790 L/sec turbo
  • VAT Variable position downstream pressure control valve


Process Equipment Options

Low Temperature Evaporation Sources (Up to Four)

  • 1cc and 10cc Sources
  • Unique Plugin Design
  • Easy to Refill and Maintain
  • Quartz crystal controller is available with thermal options
  • KJLC 10cc and 1cc (Low Temperature Evaporation) source, suitable for Organic and low temperature materials (0-550°C)

Thermal Evaporation Source (Up To Four)

  • KJLC Thermal evaporation (TE) assembly, Up to four 4" thermal evaporation sources (in sequential or co-deposition configurations)
  • KJLC Thermal evaporation (TE) assembly, Up to six 2" thermal evaporation sources (in sequential configuration)
  • Standard thermal power supply (5v @ 375A)
  • High output power options (5v @900A)
  • Quartz crystal controller is available with thermal options

Magnetron Sputtering Source Power Supplies (Up to Five)

  • 500W, and 1kW, and 1.5kW KJLC® DC power supplies
  • 300W and 600W KJLC RF power supplies
  • 2kW (pulsed) DC power supply
  • Quartz crystal monitor is available with sputtering options

Torus® Magnetron Sputtering Source (Up to Six)

  • Up to six KJLC Torus® 2" or 3" magnetron sputtering sources. Flex head assembly and high strength magnet assemblies options available.
  • Up to four KJLC Torus® 4" magnetron sputtering sources. Flex head assembly and high strength magnet assemblies options available

For more information on our new Mag Keeper sources please see the following link.

Electron Beam Evaporation Source

  • KJLC KL6, four pocket (8cc) E-Beam source
  • KJLC KL8, eight pocket (12cc) or six pocket (20cc) E-Beam source
  • 5kW or 10kW solid state power supply with programmable sweep and automatic crucible indexing


Substrate Options

Substrates

Standard Substrate Fixtures

Size
100mm x 100mm
4"
100mm x 100mm
4"
Style
Multi-site
(accommodates multiple substrate(s) and sizes)
Multi-site
(accommodates multiple substrate(s) and sizes)
Single holder*
Single holder*
Rotation
Up to 20 RPM
Up to 20 RPM
Up to 20 RPM
Up to 20 RPM
Heating
Up to 350°C
Up to 350°C
Up to 350°C
Up to 350°C
Cooling
Yes
Yes
N/A
N/A
Transfer
N/A
N/A
Yes
Yes



Upstream Pressure Control

  • Up to four Fujikin FCST1000F Mass Flow controllers and a 100mTorr Capacitance Manometer

Reactive Depositions

  • One Fujikin FCST1000F Mass Flow controller and a 100mTorr Capacitance Manometer
  • Up to three Fujikin FCST1000F Mass Flow controllers for a reactive gas.
  • Substrate gas ring is available

Glovebox Adaptors

The SPECTROS™ Series is now easily integrated with a glove box. The process chamber features large sliding, full-access, aluminum doors. This new chamber design makes opening and closing the chamber door inside the glovebox a snap while providing quick and easy access to your substrate fixture and deposition sources. There is also a large swing style rear door for easy access to maintain the system.

Kurt J Lesker is able to offer a wide array of standard and custom glovebox suites, from a standard 4 port or 6 port arrangement, to custom lengths and depths.

Glovebox Specifications

  • All stainless steel construction of the glovebox
  • Specifically designed to integrate with KJL deposition system
  • All stainless steel Swagelok valves, fittings and piping
  • Modular design (for easy expansion)
  • Lexan front window
  • Quick release front window
  • Electrical feedthrough with a six (6) outlet power strip
  • LED light fixtures
  • All stainless steel antechamber; size 15" diameter x 24"L with sliding tray
    • Shock assisted door lifting mechanisms
  • All stainless steel mini antechamber; size 8" diameter x 15"L
  • Stainless steel stand with leveling feet and casters
  • Stainless steel vacuum gauges
  • Adjustable bin storage unit (adjustable shelving)
  • Spare KF40 feedthroughs
  • Two (2) HEPA gas flow filters; one (1) inlet, one (1) outlet
  • Push button evacuation and refill of antechamber
  • All stainless steel 24V DC solenoid valve for refill of antechamber
  • Automatic electro-pneumatic valve for evacuation of the antechamber (KF40)
  • Common vent line
  • Stainless steel filter column for the removal of oxygen and moisture including automatic electro-pneumatic valves (KF40 size)
  • Fully automatic system with Siemens PLC control unit and 7" color touch screen with built in operating instructions and system diagnostics. Includes:
    • O2, H20 and pressure trending
    • Maintenance alarms
    • Power saver mode for vacuum pump/lights (optional)
  • Automatic regeneration process using 3-5% hydrogen gas mixture
  • Capable of removing 36 liters of oxygen from inert gas before needing a regeneration
  • Capable of removing 1300 grams of moisture from inert gas before needing a regeneration
  • Continuous oxygen monitoring
  • Continuous moisture monitoring
  • Includes 50 cfm circulation blower
  • Built for continuous operation
  • Manual solvent removal system including stainless steel filter column, 10lbs of activated carbon, manual bypass and isolation valves, evacuation and refill valves, and refill drain port (optional)
  • Automatic solvent removal system including stainless steel filter column with 20lbs of molecular sieve, automatic bypass and isolation valves with automatic reactivation of filter material (optional)
  • Automatic purge valve-200 L/min flow rate

Glovebox Options

Along with the gloveboxes and system adaptor boxes the following accessories can be supplied:

  • Spin Coaters
  • Hot Plates
  • UV Ozone Curing
  • Regenerable Solvent Purification System
  • Other accessories upon request

Pumping:

The Mini SPECTROS offers two types of high vacuum pumping on its process chamber a Pfeiffer 790 L/s turbomolecular pump as standard or an optional Brooks CTI-8F 1500 L/s cryo pump. Either pump is an option for any of the deposition configurations for the Mini SPECTROS. The Pfeiffer 790 L/s being a good choice for overall cost effective high quality pumping particularly for Low Temperature and Thermal evaporations. The Brook CTI-8F finding use in applications that require the lowest vacuum possible particularly for thermal evaporation and electron beam applications.

The chart to the right demonstrates average expected pumping performance by pump type for an outfitted Mini SPECTROS process chamber that is clean and dry with (3) Torus 3" Mag-keeper sources installed and a 3' long 1.5" metal flex bellows roughing line.

Pump curves for a clean dry and empty Mini SPECTROS. Pumping performance is depending on chamber conditions and components installed.

The Mini SPECTROS was re-designed to mount the high vacuum valve directly to the process chamber without the 4" half nipple and now accommodates a larger 790 L/s pump or CTI8 pump. This allows the Mini SPECTROS to reach lower base pressures and faster pumpdown times than similarly equipped systems.

Deposition:

Torus® sources are operated at typical sputtering pressures (< 20 mTorr) and utilize Si wafers for deposition. SiO2 Target run with RF Power, film thickness >=500Å. Al Target run with DC Power, film thickness >=1500Å. Ni Target run with High Strength Torus® & DC Power, film thickness >=1500Å.

KJLC electron beam deposition runs utilize Si wafers for deposition. Ti evaporant material with film thickness >=1500Å.

  • All Films are measured on a properly calibrated Profilometer, Reflectometer or Ellipsometer (if applicable).
  • Measurement points are taken starting at the center of the substrate and then radially outward every 0.5 inches (12.7mm), nominally (reference figure to the right).
  • Uniformity calculation formula is: ((Max - Min) / (2 x Avg)) x 100% with a 0.2 inch (5mm) edge exclusion.

KJLC E-beam sources are also designed to eliminate unnecessary o-rings, seals, and feedthroughs to lower pumpdown times and provide excellent base pressures. Only three feedthrough's are required for the KJLC E-beam source and there is no dynamic water to vacuum o-ring seal in this design which greatly reduces the risk of a water leak in the vacuum chamber.

Thermal evaporation sources typically centered on the substrate fixture have been moved to the outer edges of the fixture in the Mini SPECTROS to allow for better uniformities. The fixtures allow a source adjustment of up to an inch to allow for optimization to a particular application.

The Mini SPECTROS is one of Kurt J. Lesker's most versatile thin film deposition systems offering single and multi-technique deposition options including LTE Evaporation, thermal evaporation, magnetron sputtering (Torus), and electron beam.

The Mini SPECTROS houses KJLC Low Temperature Evaporator. With its unique plugin base that allows for easy access to refill the crucible and easy removal for cleaning and maintenance.

Typical Deposition Uniformities

Sources
Substrate size
Uniformity
Low Temperature evaporation Sources
100mm x 100mm
<=+/-5%
Thermal Evaporation Source
100mm x 100mm
<=+/-5%
Torus® Sputtering Sources
100mm x 100mm
<=+/-5%
KL-6 Electron Beam source
100mm x 100mm
<=+/-5%



Only KJLC offers Mag-Keeper sputter sources with zero o-rings in the cathode body and a magnetically coupled target to allow for easy target changes. Our "patent pending" cooling well design enables operation at power densities ≥ 200 watts/.in2. This cathode is designed to sputter up to a 0.375" thick targets. The high strength design is able to sputter up to a 0.125" thick Fe target with 3" and 4" cathodes, or 0.0625" thick Fe target with 2" Mag-Keepers. Without a hold down clamp or dark space shield this cathode is capable of running as low as ≤ 1mTorr. The unique dome shutter design eliminates the need for additional cross contamination shielding required with standard flip or swing shutters.

To learn more about sputtering rates and uniformity, click here.



Architecture Overview

KJLC® eKLipse™ Control Software

Kurt J. Lesker Company® eKLipse™ Controls Software is utilized on all KJLC platforms. The eKLipse™ controls platform utilizes a .NET application running on a Windows PC for its User Interface and Recipe Editor. Equipment automation is accomplished via a standalone Real Time Controller.

Click to view Dwg-SY-eKLipseControlsSoftware_01

Recipes

  • Graphical Recipe Builder – Easily create recipes by clicking on the desired component and set that item's attributes







Click to view Photo-SY-Scipted-Recipe-Builder.jpg
  • Scripted Recipe Builder – A more traditional "scripted" recipe editor exposes more details for setting or checking the value of any system component during a process.



Reliable

This control platform was developed by <strong>KJLC's global engineering team</strong> and is supported by <strong>KJLC global service center</strong>.
  • Real Time Controller – The system operates independently of the Windows software package and will continue the recipe should the software / computer malfunction.
  • Independent Thermal Evaporation Thin Film Control – There is no third party software requiring a "handshake" or "handoff" between the Systems Manufacturers software and the thin film controller's software.



Unlimited Recipes, (import/export capable)

  • Unlimited recipes with user security level features
  • Recipe import/export capability (for transferring recipes between similarly equipped tools)
  • Any recipe step can be configured to allow the user to alter a value, enabling process condition changes, without affecting the master recipe. As an example, at the time of execution, the recipe can prompt the user for the desired deposition thickness, or power setting.
Click to view Photo-SY-User-Set-Values.jpg

Click to view Photo-SY-Multi-PC-Control.jpg
  • Consistent User experience across all deposition techniques and KJLC platforms (Sputter, Thermal, EBeam, ALD)
  • Multi chamber and multi PC control for cluster tools



Custom Chart Recorder and Datalogging

  • Custom Chart with up to 10 simultaneous plots
  • Chart Recorder can be used to display any setpoint or feedback parameter
Click to view Photo-SY-Chart-Parameter-Selection.jpg

Click to view Photo-SY-Save-Chart-Parameters.jpg
  • Automatic datalogging of each recipe step for all recipes
  • Chart data and configuration can be saved

  • Graphical selection of signals to be recorded









Custom Maintenance Counters

  • Custom Maintenance Counters are available for each component
  • Periodic Maintenance interlocks and recipe checks can be configured for any maintenance counter
  • Sputter Target kiloWatt*Hour and custom material usage tracking








User Security

  • Supports multiple user accounts and password levels with custom security access for recipes and screens
  • Software screen access can be customized per user
  • Recipe editing and manual operation features can be assigned on a per user basis;
  • Users with full access have the ability to edit recipes and control interlocks. Restricted access users will be limited to running certain recipes and have no control over interlocks.
  • Every control object can be assigned to a standard user security level.
  • Individual screen access can be separately assigned to any user.
Click to view Photo-SY-system-users.jpg



Multi User Facility Features

Click to view Photo-SY-fab-user-logged-in.jpg
  • System event log captures all user login/logout events, all recipes executed, and system status messages
  • Interlocking of vacuum and deposition equipment provides continuous system status monitoring while restricting unapproved system usage (no need to 'power off' system screen or PC)



Remote Support Utility and Apps

  • Customized Version of TeamViewer allows remote support (free Android and IOS apps)
  • Remote connection supports system monitoring/control and file transfer
Click to view Photo-connected-devices.jpg

Downloads & Documents

View information on major components, floor planning and site preparation regarding your product.

Datasheet:

Pumping:

Sources:

Power Supplies:

White Papers

Materials Overview

Our Materials Division stocks a vast assortment of high purity materials, evaporation sources, and crucible liners for use in both thermal and E-beam evaporation as well as sputter deposition processes. We offer pure elements, compounds, alloys, ceramics, intermetallics, and mixtures in a variety of shapes, sizes, and purities for both R&D and Production applications. Each sputtering target and evaporation material ships complete with a Certificate of Analysis and SDS. We also provide in-house sputter target bonding and precious metals reclamation services, saving you both time and money.

Sputter Targets

We manufacture a wide range of target materials designed to meet the demanding needs of both Production customers as well R&D customers needing a custom one off target. We are able to offer various purities, materials, sizes, and compositions. Our experienced in house bonding team is also able to provide high quality bonding services using KJLC or customer supplied backing plates. Many standard sizes and configurations available to ship directly from stock.

Evaporation Materials

KJLC stocks a wide variety of evaporation materials in various sizes, shapes and quantities, available for immediate shipment. The range of materials offered is extensive, including pure metals, precious metals, standard alloys, oxides, nitrides, and fluorides. The materials can be packaged for the small quantity user, as well as, for the large volume production customer.

Precious Metals

Our unique offering of precious metal products protects our customers from daily market price fluctuations by locking in the price on the day the order is placed. Inventory management tools allow us to stock a variety of precious metal products in standard target configurations, as well as, pellet, shot, and wire for evaporation. Shipments are packaged per order in the quantities our customers require, allowing them to purchase as much or as little as they need. Because of the high value of these materials we offer a convenient reclaim service for precious metal scrap. Credit is applied quickly to customer accounts which can be used to fund their next purchase. Kurt J. Lesker Company understands that these high cost materials require tight controls and close management. Our goal is to make precious metal purchases as easy as possible for our customers.

Thermal Sources

As a complement to the extensive offering of evaporation materials, a wide range of thermal evaporation sources are available to our customers. Hundreds of boat sources with differing geometries and capacities make it easy to find a source that is ideally suited to coat numerous materials onto substrates of various configurations. Many materials prove troublesome for evaporation and may require a different style of evaporation source. In addition to boat sources, alternative sources such as filaments, baskets, box heaters, and heaters with crucibles may be the solution to evaporating these more difficult materials. A wide range of products are available to ship from stock with evaporation materials or as replacements.

Ceramic Materials Manufacturing

The Kurt J. Lesker Company continues to expand process capabilities in ceramic manufacturing to meet the evolving requirements for these demanding products. In-house powder synthesis capabilities, utilizing various chemical techniques, give us the ability to manufacture custom stoichiometries for both R&D and production material requirements. Proprietary mixing and sintering methods yield homogeneous, high density products ideally suited for PVD applications. Hot pressing is also utilized to enhance the variety of ceramics that can be offered.

Quality

At the Kurt J. Lesker Company quality is our highest priority. Our ISO 9001 certification ensures that product quality is never compromised. All of our products undergo the requisite level of quality control inspection and all materials are shipped with a certificate of analysis and material safety data sheet. We employ numerous analytical techniques at various stages in the process to ensure that the products meet our quality standards and perform in the demanding applications which they are used.

Technical Support

As a leading manufacturer of PVD equipment, we have quite a few technical resources within the organization. We are happy to help troubleshoot or offer advice on process related questions ranging from sputtering powers to crucible selection.

Would You Like More Information?

Do you have any questions? Click below to get in contact with one of our many experienced team members.

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