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Jeffrey R. Shallenberger of the Materials Research Institute at Penn State University has led a groundbreaking study demonstrating the detection of trace oxygen levels—down to 0.1 atomic percent—in highly reactive thin films using X-ray Photoelectron Spectroscopy (XPS). This work sets a new benchmark for precision in surface analysis and thin film quality control.

The Kurt J. Lesker Company is proud to announce the launch of the Pro Line Roll-to-Roll (R2R) Module, a transformative enhancement to the industry-leading Pro Line PVD 200 Thin Film Deposition System. This new, cost-effective, drop-in module brings true roll-to-roll coating capability to the PVD 200 platform, empowering researchers and product developers to bridge the gap between laboratory-scale experimentation and scalable pilot production of flexible electronic devices.

In the high-stakes world of thin film deposition, especially for functional oxides, nitrides and other compounds made by reactive sputtering with metals, precision is everything.

The Kurt J. Lesker Company is proud to announce the release of its latest publication, Fundamentals of Vacuum Science Volume 1. This comprehensive guide is an essential resource for anyone interested in the principles and applications of vacuum science and system design for high and ultrahigh vacuum environments.

In the ever-evolving world of semiconductor technology, innovation is the key to staying ahead. At Kurt J. Lesker Company, we are proud to announce a groundbreaking achievement that promises to revolutionize the field of Atomic Layer Deposition (ALD). Our latest publication, featuring the patented Precursor Focusing Technique (PFT) and Ultra-High Purity (UHP) process capability, marks a significant milestone in our commitment to advancing next-generation applications.

Nanoscale magnetic tunnel junctions (MTJs) are set to revolutionize high-density memory storage. These advanced nanostructures, composed of two ferromagnetic layers separated by an insulating barrier, utilize quantum mechanical tunneling to read and write data efficiently. Their ability to maintain data integrity even at extremely small scales makes them ideal for next-generation memory technologies like Magnetic Random Access Memory (MRAM)...

We are proud to announce a new development from our Process Equipment Division a Full Target Encapsulation (FTE) Shutter, focused on developing a magnetron shutter design that is both compact and effective in eliminating cross-contamination between sources. This dedication to innovation and customer satisfaction has led to the creation of a pioneering product that not only meets but exceeds performance expectations. That is why we are excited to announce a development in technical capabilities that significantly enhances the our magnetron shutter design, particularly in achieving near-zero cross-contamination.

The Kurt J. Lesker Company, has expanded the capabilities of its Pittsburgh thin film applications laboratory with the addition of a model KDF 603 pilot production thin film deposition system, from its newly acquired subsidiary, KDF Technologies. The addition of the KDF thin film deposition tool will enable our Pittsburgh-based experts to perform coating trials for new prospects while optimizing the 603 system with the addition of features including plasma emission monitoring – critical to reactive sputtering.

The United States is engaged in a colossal effort to reshoring critical semiconductor manufacturing technology in order to better insulate domestic demand from international supply chain instabilities. This will create thousands of new jobs, requiring a substantial expansion of the US workforce skilled in vacuum science and its application.

JEFFERSON HILLS, PA, August 4, 2023 - Kurt J. Lesker Company (KJLC) has been granted a pivotal patent by the United States Patent Office. The patent, identified under US 11,631,571B2 dated April 18, 2023, focuses on the application of Ultra-High Purity (UHP) conditions to Atomic Layer Deposition (ALD) and Plasma-Enhanced ALD (PEALD) systems, offering significant advancements in atomic scale processing research and applications.